
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
TVS Diode Arrays (SPA
®
Diodes)
SP3051
Lightning Surge Protection - SP3051 Series
Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat
rehea
Ramp-up
amp-up
Ramp-down
amp-d
Critical Zone
T
L to TP
ritical Zon
to
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Ordering Information
Part Number Package Marking Min. Order Qty.
SP3051-04HTG SOT23-6 YH4 3000
Part Numbering System
Part Marking System
SP
3051
04
H T
G
Series
Number of
Channels
Package
H: SOT23-6
T= Tape & Reel
G= Green
–
TVS Diode Arrays
(SPA
®
Diodes)
Y*4
Y * 4
Product Series
Number of Channels
Assembly Site
(Varies)(Varies)
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold ash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
6. All specications comply to JEDEC Spec MO-178AB Issue C
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