Littelfuse SP3012 Series Uživatelský manuál stáhnout pdf (Strana 6)

Speciﬁcations are subject to change without notice.

TVS Diode Arrays (SPA

Diodes)

Revision: 09 2, 13

SP3012 Series

Low Capacitance ESD Protection - SP3012 Series

Package Dimensions— µDFN-10 (2.5x1.0x0.5mm)

Package µDFN-10 (2.5x1.0x0.5mm)

JEDEC MO-229

Symbol

Millimeters Inches

Min Nom Max Min Nom Max

A 0.48 0.515 0.55 0.019 0.020 0.021

A1 0.00 -- 0.05 0.000 0.022

A3 0.125 Ref 0.005 Ref

b 0.15 0.20 0.25 0.006 0.008 0.012

b1 0.35 0.40 0.45 0.014 0.016 0.018

D 2.40 2.50 2.60 0.094 0.098 0.102

E 0.90 1. 0 0 1. 10 0.035 0.039 0.043

e 0.50 BSC 0.020 BSC

L 0.30 0.365 0.43 0.012 0.014 0.016

Top View

Bottom View

0.05 C

Seating

Plane

Side View

0.10

0.05

2xR0.075mm (7x)

R0.125

0.05 C

Z (C) G

(Y1)

Soldering Pad Layout

Recomended

Top View

Bottom View

0.05 C

Seating

Plane

Side View

0.10

0.05

2xR0.075mm (7x)

R0.125

0.05 C

Z (C) G

(Y1)

Soldering Pad Layout

Recomended

Soldering Pad Layout Dimensions

Inch Millimeter

C (0.034) (0.875)

G 0.008 0.20

P 0.020 0.50

P1 0.039 1. 0 0

X 0.008 0.20

X1 0.016 0.40

Y 0.027 0.675

Y1 (0.061) (1.55)

Z 0.061 1.55

Z (C) G

(Y1)

Soldering Pad Layout

Alternative

Embossed Carrier Tape & Reel Speciﬁcation— µDFN-10

Package µDFN-10 (2.5x1.0x0.5mm)

Symbol Millimeters

A0 1.30 +/- 0.10

B0 2.83 +/- 0.10

D0 Ø 1.50 + 0.10

D1 Ø 1.00 + 0.25

E 1.75 +/- 0.10

F 3.50 +/- 0.05

K0 0.65 +/- 0.10

P0 4.00 +/- 0.10

P1 4.00 +/- 0.10

P2 2.00 +/- 0.05

T 0.254 +/- 0.02

W 8.00 + 0.30 /- 0.10

5º Max

User Feeding Direction

Pin 1 Location

1 2 3 4 5 6 7 8

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