SIDACtor
®
Protection Thyristors
155
Revised: February 22, 2011
© 2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Baseband Protection (Voice-DS1)
Capacitance Values
Note: Off-state capacitance (C
O
) is measured at 1 MHz with a 2 V bias.
Part Number
pF
Pin 1-2 / 3-2 (4-5 / 6-5)
Tip-Ground, Ring-Ground
pF
Pin 1-3 (4-6)
Tip-Ring
MIN MAX MIN MAX
A2106UA6Lxx 20 60 10 30
A5030UA6Lxx 15 35 10 45
A2106UB6Lxx 20 60 10 30
A5030UB6Lxx 15 35 10 45
A2106UC6Lxx 20 70 10 45
A5030UC6Lxx 25 40 20 35
P1556UALxx 20 45 10 30
P1806UALxx 20 40 10 30
P2106UALxx 15 35 10 25
P2356UALxx 15 35 10 25
P2706UALxx 15 35 10 25
P3206UALxx 15 30 10 20
P3406UALxx 15 30 10 20
P5106UALxx 10 20 5 15
P1556UBLxx 20 45 10 30
P1806UBLxx 20 40 10 30
P2106UBLxx 15 35 10 25
P2356UBLxx 15 35 10 25
P2706UBLxx 15 35 10 25
P3206UBLxx 15 30 10 20
P3406UBLxx 15 30 10 20
P5106UBLxx 10 20 5 15
P1556UCLxx 30 55 20 35
P1806UCLxx 30 50 15 35
P2106UCLxx 30 45 15 30
P2356UCLxx 25 40 15 30
P2706UCLxx 25 40 15 30
P3206UCLxx 20 35 15 25
P3406UCLxx 20 35 15 25
P5106UCLxx 20 30 10 20
Physical Specifications
Environmental Specifications
Lead Material Copper Alloy
Terminal Finish 100% Matte-Tin Plated
Body Material
UL recognized epoxy meeting flammability
classification 94V-0
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
Figure 1
Soldering Parameters
High Temp Voltage
Blocking
80% Rated V
DRM
(V
AC
Peak
¡$PS¡$
504 or 1008 hrs. MIL-STD-750 (Method 1040)
JEDEC, JESD22-A-101
Temp Cycling
¡$UP¡$NJOEXFMMVQUP
cycles. MIL-STD-750 (Method 1051) EIA/JEDEC,
JESD22-A104
Biased Temp &
Humidity
52 V
DC
¡$3)VQUPIST&*"
JEDEC, JESD22-A-101
High Temp Storage
¡$IST.*-45%.FUIPE
JEDEC, JESD22-A-101
Low Temp Storage -65°C, 1008 hrs.
Thermal Shock
¡$UP¡$NJOEXFMMTFDUSBOTGFS
10 cycles. MIL-STD-750 (Method 1056) JEDEC,
JESD22-A-106
Autoclave (Pressure
Cooker Test)
¡$3)BUNVQUPIST&*"
JEDEC, JESD22-A-102
Resistance to Solder
Heat
¡$TFDT.*-45%.FUIPE
Moisture Sensitivity
Level
3)¡$ISTSFnPXDZDMFT
¡$1FBL+&%&$+45%-FWFM
Reflow Condition
Pb-Free assembly
(see Fig. 1)
Pre Heat
- Temperature Min (T
s(min)
)
¡$
- Temperature Max (T
s(max)
)
¡$
- Time (Min to Max) (t
s
)
60-180 secs.
Average ramp up rate (Liquidus Temp (T
L
)
to peak)
3°C/sec. Max.
T
S(max)
to T
L
- Ramp-up Rate
3°C/sec. Max.
Reflow
- Temperature (T
L
) (Liquidus)
¡$
- Temperature (t
L
)
60-150 secs.
Peak Temp (T
P
) ¡$
Time within 5°C of actual Peak Temp (t
p
)
30 secs. Max.
Ramp-down Rate 6°C/sec. Max.
Time 25°C to Peak Temp (T
P
)
8 min. Max.
Do not exceed ¡$
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