
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/21/14
5×20mm
> Medium Acting > 201P Series
Cartridge and Axial Lead Fuses
Average Time Current Curves
0
.
0
0
1
0
.
0
1
0
.
1
1
1
0
1
0
0
1
,
0
0
0
1
0
,
0
0
0
1
0
0
,
0
0
0
Time (sec.)
II
II
I
FaultFault
FaultFault
Fault
/ I / I
/ I / I
/ I
RatedRated
RatedRated
Rated
2 3 4 5 6 7 8 9 011
151.5
DIN 41571, T.2 (32mA ... 1.25A)
I-t Characteristics
(Min-Max Limit)
Temperature Rerating Curve
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(DependsonFluxActivationTemperature)
(TypicalIndustryRecommendation)
TemperatureMinimum:
100
°C
TemperatureMaximum:
150
°C
PreheatTime: 60-180seconds
Solder Pot Temperature:
280
°CMaximum
Solder Dwell Time: 2-5seconds
Recommended Hand-Solder Parameters:
SolderIronTemperature:350°C+/-5°C
HeatingTime:5secondsmax.
Note: These devices are not recommended for IR or
Convection Reflow process.
Recommended Process Parameters:
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